EUV lithography uses 13.5-nanometer wavelength light to etch circuit patterns onto silicon at resolutions impossible with any other technology. The machines cost approximately $200 million each. Building one requires components from more than 5,000 suppliers across dozens of countries. ASML is the only company that can integrate all of them.
The technology took three decades and billions in development funding, including direct investment from Intel, TSMC, and Samsung. The intellectual property is layered across materials science, precision optics, plasma physics, and software systems. This is not a product that can be reverse-engineered or quickly replicated.
ASML's customers, TSMC, Samsung, Intel, and a small number of other chipmakers, are collectively spending hundreds of billions on new semiconductor fabrication capacity through the end of the decade. Every leading-edge fab requires EUV machines. Some require high-NA EUV, the next generation of ASML's technology, for 2-nanometer and below node manufacturing.
Revenue has grown from $18.6 billion in 2021 to approximately $32.7 billion in 2025, a 76% increase in four years. But the growth has not been linear: 2022 was strong, 2023 and 2024 showed slower growth as customers worked through existing inventory, and 2025 has seen a resumption of growth as leading-edge fab construction accelerates.