ASML's most important forward indicator is its order backlog. The company does not disclose the backlog in granular detail, but management commentary and industry analysis suggest it remains above 30 billion euros as of early 2026. That implies more than one year of revenue at current run rates is already contracted.
The backlog is predominantly driven by AI-related semiconductor demand. TSMC, the primary beneficiary of AI chip orders from Nvidia, Apple, and AMD, has announced aggressive capacity expansion plans through 2027 and 2028. Those fabs require EUV machines, and the lead times for EUV delivery run 12 to 18 months. Orders placed today show up in revenue 18 months from now.
High-NA EUV is an additional driver that is not yet material to revenue but will become so. The per-unit price is more than double that of standard EUV. If adoption follows the pattern of standard EUV, where uptake was slow initially before becoming mandatory for leading-edge production, High-NA could add several billion euros to annual revenue by 2028 or 2029.
DUV revenue is more complicated. China historically represented 25 to 30% of ASML's DUV revenue. Export controls have curtailed new system sales to China, though spare parts and service revenue remain permitted. The loss of incremental China DUV business reduces growth potential in the near term. Any further escalation in export restrictions could accelerate that headwind.
Replacement demand from other regions, including Japan, Southeast Asia, and Europe through CHIPS Act-funded expansions, can partially offset what China represented. Whether the offset is full or partial depends on the scale of domestic chipmaking investment in each region, which is still early-stage in Europe and Southeast Asia.